Austria·Buyer: Silicon Austria LabsSilicon Austria Labs – Laser drilling machine for fan-out wafer level packaging
Awarded·7 Aug 2026·EUR 469,747
The aim of this procurement procedure was to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of a laser drilling machine for fan-out wafer level packaging for Silicon Austria Labs GmbH.
Published
07.08.2026
Awarded
07.08.2026
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