The aim of this procurement procedure was to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of an ion beam trimming tool for Silicon Austria Labs GmbH.
Published
12.08.2026
Awarded
12.08.2026
Silicon Austria Labs – Chips JU: In-line metrology tool for thin-film measurements
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Silicon Austria Labs – Laser drilling machine for fan-out wafer level packaging
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Entwicklung eines 3-D Helmholtz-Spulensystems
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Sondergaskabinett Neon
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Hybrid Wafer Bonding
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Silicon Austria Labs – Frame / wafer cleaning unit
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