The aim of this procurement procedure was to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning as well as optional services such as trainings of a frame / wafer cleaning unit for Silicon Austria Labs GmbH.
Published
06.08.2026
Awarded
06.08.2026
Silicon Austria Labs – Chips JU: Ion Beam Trimming Tool
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Silicon Austria Labs – Chips JU: In-line metrology tool for thin-film measurements
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Silicon Austria Labs – Laser drilling machine for fan-out wafer level packaging
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Entwicklung eines 3-D Helmholtz-Spulensystems
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Sondergaskabinett Neon
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Hybrid Wafer Bonding
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