The aim of this procurement procedure was to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of an in-line metrology tool for thin-film measurements for Silicon Austria Labs GmbH.
Published
12.08.2026
Awarded
12.08.2026
Silicon Austria Labs – Chips JU: Ion Beam Trimming Tool
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Silicon Austria Labs – Laser drilling machine for fan-out wafer level packaging
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Entwicklung eines 3-D Helmholtz-Spulensystems
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Sondergaskabinett Neon
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Hybrid Wafer Bonding
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Silicon Austria Labs – Frame / wafer cleaning unit
Active
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