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Finland·Buyer: VTT Technical Research Centre of Finland

Wafer metrology

Awarded·30 Aug 2026·EUR 464,674

Wafer metrology The object of the tender was semi-automatic wafer metrology tool (later also “tool”) for measurement of total thickness, TTV (total thickness variation), warp, bow, metallization bumps, trench or via depth and geometric factors in substrates typical in semiconductor industry such as but not limited to silicon wafers, chips, stacked wafers, stacked chips, samples containing mixed oxides, or/and thin materials deposited. The tool had to be compatible with installation in an ISO 4 classified cleanroom. The object of the tender process was described in more detail in the invitation to tender documents.,

Published

30.08.2026

Awarded

30.08.2026

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