Finland·Buyer: VTT Technical Research Centre of Finland

Semi-Automatic Wafer Grinder

Awarded·12 Feb 2026·EUR 325,000

Semi-Automatic Wafer Grinder The object of the tender was a Semi-Automatic Wafer Grinder with manual wafer loading and unloading on the chuck table (later also “Equipment”), capable of thinning Si, SiC, LiNbO3 and other typical semi-conducting wafers of 200 and 300 mm diameter to varying thicknesses with end-point control, TTV profile control, capability to thin wafers down to 10um thickness with supporting tape and capability to grind only a determined distance from edge-to-center. Equipment had to be new. The tool had to comply with cleanroom equipment standard safety and contamination requirements. The object of the tender process was described in more detail in the invitation to tender documents.,

Published

12.02.2026

Awarded

12.02.2026

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