Finland·Buyer: VTT Technical Research Centre of Finland

Defect inspection system

Awarded·14 Oct 2026·EUR 1,190,000

Defect inspection system VTT is looking to acquire an automated defect inspection tool for 200 mm and 300 mm patterned wafers. The tool will enable rapid tracking of defects that appear during the manufacturing process of functional devices (in-line and end-of-line in the Front-end process). The tool must be capable of detecting particles, voids, cracks, scratches, pits, bumps, and hazes in the pattern. The materials of the patterns that the machine must be able to analyze are silicon oxides and nitrides, polysilicon, metals, and photoresist. The object of the tender process and the technical requirements are described in more detail in the invitation to tender documents.,

Published

14.10.2026

Awarded

14.10.2026

Deadline

14.04.2027

Notice of discontinuation: Edge-Handling Sputtering Cluster Tool

Awarded·Oct 14

—

Full spectrum vibro-acoustic software

Open for bids·Oct 8

—

STA-GC-MS system

Awarded·Oct 6

EUR 286,000

Confocal Raman microscope for particle morphology and material identification

Open for bids·Sep 24

—

Kelvin probe force microscopy (KPFM)

Awarded·Sep 13

EUR 177,100

Carbonization and activation unit

Awarded·Sep 6

EUR 337,310

Find tenders worth bidding for.

Create an account to explore this tender and find similar opportunities.

Tender documentsReview available files in one workspace.
Requirements and risksRequest a document analysis with references to the sources.
Your tender selectionContinue with your selected markets and sectors.