Germany·Buyer: Lehrstuhl für Technische Physik E23, TUM

Deposition Tool 8 Inch

Closed·21 Aug 2026

The Technical University of Munich - Chair of Technical Physics E23/WMI will acquire a UHV cluster System for the fabrication of superconducting circuits on 8 inch'' wafers. The system must provide UHV conditions and has to include an HV load-lock chamber, a central handling chamber, a UHV chamber for the evaporation of Al thin films, a UHV chamber for sputtering of superconductors, a UHV chamber for oxidation, a UHV chamber for Ar ion milling, and a flipping station. The system must allow metalizing both sides of the wafers in situ, with minimal backside particle contamination. The wafers should only be touched on the side (edge gripping).

Published

21.08.2026

Open for bids

21.08.2026

Conditions updated

21.08.2026

Deadline

05.10.2026

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