*Semiconductor devices *Laboratory and scientific equipment
Published
23.01.2026
Deadline
06.02.2026
26-58077 ACAN Integrated High‑Density Laser Diode Burn‑In and Characterization Platform
ACAN 26-58022 Automated Wafer Defect Inspection System and ICP Plasma Processing Module
ACAN 26-58022 Automated Wafer Defect Inspection System and ICP Plasma Processing Module
A supply of 3" Indium Phosphide prime grade wafers and 3" and 4” ultra-flat Silicon wafers prime grade wafers
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