Metal CMP and brush cleaner

Description

Metal CMP and brush cleaner THE OBJECT OF THE PROCUREMENT The procurement concerns the delivery of an automatic metal Chemical Mechanical Polishing (CMP) system with an integrated wafer cleaner for processing and planarization of 200 mm semiconductor wafers. The scope includes the fully configured CMP tool, integrated cleaning unit, required accessories, and delivery, installation, and commissioning. Tool is acquired for processing of following applications: 1. Copper and barrier polishing steps for a. Integrated passive components b. CMOS wafers Back-End-of-the-Line (BEOL) and Mid-End-of-the-Line (MEOL) c. Hybrid bonding d. Above structures may include also low K materials which need special cleaning methods 2. Through-silicon via (TSV) a. overburden metallization removal b. Silicon, silicon dioxide and silicon nitride polishing during the TSV back side processing 3. Quantum computing related materials polishing Tool to be acquired needs to be able to deliver industrial level quality & repeatability while allowing flexibility in research and technology organisation environment: polishing is done on both wafers that meet SEMI standards and wafers and wafer stacks with non-standard thicknesses, non-beveled edges with large edge exclusions & fragile edges. Single tool is acquired to serve several polishing processes that include copper, insulators and quantum related materials; several polishing platens for several consumable sets are needed. The polishing tool configuration is based on the above constraints. The equipment includes 3 polishing platens each with integrated in-situ capable pad conditioning systems, several end-point detection systems on each platen, multi-zone membrane carrier heads, slurry feed inputs for at least 4 slurries and DIW per platen and platen temperature control or cooling. The system needs to be equipped with an integrated wafer cleaner with capability to vapour drying for low k materials. Wafers are handled through SEMI Standard Mechanical Interface (SMIF) in a Dry-In Dry-Out (DIDO) fashion for at least SEMI standard 200mm wafers 725um thick. Additionally non-standard and fragile wafer material needs the option for a Dry-In Wet-Out (DIWO) approach omitting cleaning. DIRECT AWARD, Article 40 2(2) of Finnish Procurement act (1397/2016) The procurement will be carried out as a direct award in accordance with 40 article Section 2(2) of the Finnish Public Procurement Act. According to the 40 § section 2(2) of the Act on Public Contracts (1397/2016), only a certain supplier can implement the procurement for a technical reason, or for a reason related to protecting an exclusive right; it shall be a further condition that there are no reasonable alternatives…