8" Semi-Automatic Waffer Dicing Saw
Buyer: VTT Technical Research Centre of Finland (FI)
Published: 8/13/2025
Category: Laboratorijas, optiskās un precīzijas ierīces (izņemot brilles).
Description
The object of the tender process is Semi-Automatic Wafer Dicing Saw for min 8inch wafers and various ceramic and glass substrates. The object of the tender process is described in more detail in the invitation to tender documents. The object of the tender process is described in more detail in the invitation to tender documents.