TCWM - Thermocompression Wafer Molding

AT · Buyer: Silicon Austria Labs · €750K · Deadline 9/20/2024 · Published 8/20/2024

Public procurement tender by Silicon Austria Labs, AT. Estimated value €750K. Submission deadline 9/20/2024. Awarded to APIC YAMADA CORPORATION. Published 8/20/2024. Buyer history and competition intelligence on Otnox.

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