Vereinigtes Königreich·Auftraggeber: University of BristolDie Bonding System
Funding is available to purchase a die attach/bonding system capable of performing a wide range of bonding processes, including ultrasonic, flip-chip, and UV curing, which is suitable for prototyping and light production runs. As a result, a crucial aspect for any die attach system under is the ability to be used for bonding runs as small as a single die should this be required. This stipulation lends itself to a semi-automated (i.e. motorised) system, ideally with the capacity to store process recipes to maximise reproducibility should the system be used for light production runs.
Veröffentlicht
01.07.2026
Offen für Angebote
01.07.2026
Frist
16.07.2026
University of Bristol - Purview, Copilot Guardrails and Power Platform Ecosystem Programme
Staff Benefits - Cycle To Work - Salary Sacrifice Scheme
Cameras and Accessories (2026)
Procurement eMarketplace, eInvoicing and eServices (2026-2029)
Provision of Thorough Examination and Testing (TExT), Maintenance and Repair of LEV Equipment not covered by Campus Division's TExT Contract
Cryogenic System
Museum Consumables for Collection Storage Framework
Cytiva Service Contract - AWARD
Provision of Colony Counter ProtoCOL 3 PLUS
Request for information - Liquid Handling Robots
Provision of Anaerobic Workstations
Replacement Arms for Tecan Equipment
Procurement of office and IT equipment
T0345 - Dry Dock & Repair of Lightvessel 06
T0345 - Dry Dock & Repair of Lightfloat 03
T0345 - Dry Dock & Repair of Lightvessel 07
Provision of External Legal Panel Support for Patrick Finucane Inquiry
Face to Face Translation Services Contract
© 2026 SIA «Vietne». Alle Rechte vorbehalten.